Distinguished Lecture - Chiplet Design and Heterogeneous Integration Packaging

The lecture focuses on the design and trends of chiplet design and heterogeneous integration packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing an in-depth study on several major topics such as chip partitioning, chip splitting, multiple systems and heterogeneous integration with TSV-interposers, multiple systems and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The lecture can benefit researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.