Distinguished Lecture - Chiplet Design and Heterogeneous Integration Packaging
The lecture focuses on the design and trends of chiplet design and heterogeneous integration packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing an in-depth study on several major topics such as chip partitioning, chip splitting, multiple systems and heterogeneous integration with TSV-interposers, multiple systems and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The lecture can benefit researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.
ZOOM: 954 7779 7730 PASSCODE: 000000
Dr. John H. Lau (Life Fellow, IEEE) received his Ph.D. degree from the University of Illinois at Urbana–Champaign, Champaign, IL, USA, in 1977. He was a Senior Scientist/MTS with the Hewlett-Packard Laboratory/Agilent, Palo Alto, CA, USA, for over 25 years. From July 2019 to July 2021, he was the Chief Technology Officer of Unimicron Technology Corporation, where he has been a Senior Special Project Assistant since July 2021. His current research interests include chiplet design and heterogeneous integration packaging, high-density hybrid substrates, organic interposers, TSV interposers, fan-out/fan-in wafer-/panel-level packaging, MEMS, mini-/micro-LED, 3-D IC integration, SMT, and solder joint reliability.
ZOOM: 954 7779 7730
passcode: 000000
Dr. Mian TAO, HKUST EPACK Lab