Technical Program Committee Members: Prof. Tim Cheng, The Hong Kong University of Science and Technology Prof. Lance Li, The University of Hong Kong Prof. Ricky Lee, The Hong Kong University of Science and Technology Secretariat: Dr. Jeffery Lo, The Hong Kong University of Science and Technology (jefflo@ust.hk) - International Symposium on
3D IC and Heterogeneous Integration
至
Zoom
Supporting the below United Nations Sustainable Development Goals:支持以下聯合國可持續發展目標：支持以下联合国可持续发展目标：
Session A: System Architecture & Design in the Era of 3D IC
26 April (Tuesday)
Chair: Prof. Tim Cheng, HKUST
Advanced System Integration Technologies- Past, Present and Future
Douglas Yu, TSMC
09:30 -10:00
Architecture Innovations with 3D Integration in the AI Era
Yuan Xie, Alibaba
10:00 - 10:30
Advanced Packaging: Enabling Moore's Law's Next Frontier Through Heterogeneous Integration
Raja Swaminathan, AMD
10:30 - 11:00
Micro-bumping vs. Hybrid Bonding: What Are the Pros and Cons Today and In the Future?
Sung Kyu Lim, Georgia Institute of Technology
11:00 - 11:30
Panel Discussion
11:30 - 12:15
Session B: 3D IC & M3D
27 April (Wednesday)
Chair: Prof. Lance Li, HKU
Co-Chair: Prof. Yang Chai, PolyU
M3D Integration using 2D Devices
Kaustav Banerjee, UCSB
14:00 - 14:30
Why Is Everybody Talking about Chiplets?
Subu Iyer, UCLA
14:30 - 15:00
3D Layer Stacking by Smart Cut Technology Enabling Manufacturing of High Density I/O
Ionut Radu, Soitec
15:00 - 15:30
3D Sequential Integration: Applications and Technology Overview
François Andrieu, CEA-Leti
15:30 - 16:00
Session C: System-in-Package & Heterogeneous Integration
28 April (Thursday)
Chair: Prof. Ricky Lee, HKUST
Delivering Power and Removing Heat
Two challenges that could become the Achilles heel for AI applications
Madhavan Swaminathan, Georgia Institute of Technology
09:30 - 10:00
Opportunities and Challenges for Heterogeneous Integration and 3D IC
Jan Vardaman, TechSearch International, Inc.
10:00 - 10:30
The Future is Fan-Out
Beth Keser, Intel Corporation
10:30 - 11:00
Chiplet Design and Heterogeneous Integration Packaging
John Lau, Unimicron Technology Corporation
11:00 - 11:30
Panel Discussion
11:30 - 12:15
活動形式
語言
英文
適合對象
校友
教職員
科大家庭
研究生
本科生
主辦單位
Office of the Vice-President for Research & Development 代表 The Hong Kong University of Science and Technology (HKUST)
Semiconductor Nanotechnology Alliance (SNA)
AI Chip Center for Emerging Smart Systems (ACCESS)
IEEE Electronics Packaging Society (EPS) Hong Kong Chapter
IEEE Electron Device Society (EDS) Hong Kong Chapter
IEEE EDA Council (CEDA) Hong Kong Chapter
報名方法
