Abstract 

The integrated circuits industry is continuously producing ever smaller microelectronic devices with ever higher power and greater packaging density. The performance reliability and stability of these new devices are affected by basic issues such as thermal heat dissipation, stress redistribution, signal transmission and mechanical protection. Strategies have been proposed to overcome these issues. However, those approaches cannot be effectively applied to the complex underfill process that is an integral part of electronic packaging. Fine control of the combined mechanical-thermal-electrical-processing-dielectric performance criteria of site-specific underfill materials for flip-chip packaging has proven very challenging. In this lecture, the speaker will review state-of-the-art advances regarding the key requirements of underfill materials for microelectronic devices.  

About the speaker 

Prof. Mai Yiu-Wing received his PhD, DSc and DSc (honoris causa) degrees from the University of Hong Kong in 1972, 1999 and 2013 respectively. In 1976, Prof. Mai joined the University of Sydney, where he obtained his DEng in 1999, and is now a University Chair and Professor of Mechanical Engineering. 

Prof. Mai's main research interests include (1) materials science and engineering covering processing-structure-property relations, manufacturing and development of innovative materials; (2) smart materials, eco-materials and biomimetics; (3) nanomaterials and nanoengineering; (4) fracture and fatigue mechanics of materials and structures; (5) design, characterisation and mechanics of interfaces / interphases; and (6) tribology and surface engineering and science. 

Prof. Mai is a recipient of the Takeo Yokobori Gold Medal of the International Congress on Fracture (2013), the A. A. Griffith Medal and Prize of the Institute of Materials, Minerals and Mining (2016), the Scala Award and World Fellowship of the International Committee on Composite Materials (2015), and the AGM Michell Medal of the Engineers Australia (2016). In 2010, he was made a Member of the Order of Australia for his service to engineering. He was also elected to the Fellowships of the Australian Academy of Technological Sciences and Engineering in 1992, the Australian Academy of Science in 2001, the UK Royal Society in 2008 and the UK Royal Academy of Engineering in 2011. In 2017, he was elected Foreign Member of the Chinese Academy of Engineering.