ECE Seminar - On-chip Rolled-up Nanomembrane Passive Electronics
Supporting the below United Nations Sustainable Development Goals:支持以下聯合國可持續發展目標：支持以下联合国可持续发展目标：
On the RF/microwave and power chips, the number of transistors is relatively small, while basic passive electronic components (e.g., inductors and capacitors) not only dominate in quantity but also occupy the majority of the chip area, becoming a bottleneck for miniaturization. The fundamental reason for this lies in the fact that passive electronic components developed using conventional planar semiconductor processes are limited to 2D or 2.5D structures, resulting in weak electromagnetic field confinement and thus low achievable energy density. To address this challenge, it is necessary to fundamentally break the existing 2D/2.5D framework for monolithic passive electronic components by implementing true 3D structures on-chip, based on conventional planar semiconductor processes. In recent years, high-integration 3D rolled-up structures on-chip have been realized by leveraging planar film stress, offering a transformative solution. In this talk, I will present the following achievements over the past years using rolled-up thin-film nanotechnology: fabrication of complex 3D rolled structures on-chip, design and manufacturing of high-performance miniaturized passive components, along with their applications in RF/microwave chips, power chips, biotechnology, and other fields.
Prof. Wen Huang holds the prestigious position of Huangshan Scholar Professor at Hefei University of Technology. He serves as the Chief Scientist for the Key Project under the National Key Research and Development Program of China, and the Leading Talent Distinguished Professor of Anhui Province. He is a senior member of the IEEE. Professor Huang graduated with a bachelor's degree from the University of Electronic Science and Technology of China. He completed his Ph.D. in Electrical and Computer Engineering at the University of Illinois at Urbana-Champaign in 2017. Following his doctoral studies, he conducted postdoctoral research at the Holonyak Micro and Nanotechnology Lab at the same university. His notable academic contributions involve pioneering and systematic research on rolled-up membrane technology and its applications in high-integration microwave and power electronics. His works, published in renowned journals such as Science, Nature Electronics, Nature Communications, Science Advances, and Nature Materials etc., include cover articles and have received significant attention. With over 100 academic papers to his name, more than 30 of which are published in top-tier journals indexed in the Journal Citation Reports (JCR), he has accumulated over 3000 citations with H-index of 20.