Technical Forum - Chiplet Technology and Heterogeneous Integration for System-in-Packaging

Chiplet technology and heterogeneous integration is an innovative assembly strategy in semiconductor manufacturing. where individual functional blocks, known as chiplets, are designed and manufactured separately. The chiplets are then integrated into a single package to create a complete system. This methodology allows for greater flexibility, scalability, and customization in designing complex electronic systems by combining different technologies and functionalities on a single package. Heterogeneous integration enables the integration of various components, such as processors, memory, sensors, and communication modules, from different manufacturers or technologies onto a single package, leading to enhanced performance, reduced size, and improved efficiency in electronic devices.