Distinguished Lecture - Chiplet Technology and Heterogeneous Integration for System-in-Packaging

1:30pm - 5:00pm
Lecture Hall C, HKUST(GZ)

Chiplet technology and heterogeneous integration is an innovative assembly strategy in semiconductor manufacturing. where individual functional blocks, known as chiplets, are designed and manufactured separately. The chiplets are then integrated into a single package to create a complete system. This methodology allows for greater flexibility, scalability, and customization in designing complex electronic systems by combining different technologies and functionalities on a single package. Heterogeneous integration enables the integration of various components, such as processors, memory, sensors, and communication modules, from different manufacturers or technologies onto a single package, leading to enhanced performance, reduced size, and improved efficiency in electronic devices.

讲者/ 表演者:
Dr. John LAU

Co-Packaged Optics - Heterogeneous Integration of Photonic IC and Electronic IC (共封装光学器件 - 光子集成电路和电子集成电路的异构集成)

讲者/ 表演者:
Dr. Kitty PEARSALL

Semiconductor Supply Chain “Eco System” Overview (半导体供应链“生态体系”概述)

讲者/ 表演者:
Dr. Chuck BAUER

Chiplets Turn 65! (小芯片到65岁了!)

讲者/ 表演者:
Prof. Xin CHEN

Introduction of State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment (省部共建精密电子制造技术与装备国家重点实验室介绍)

讲者/ 表演者:
Prof. Wenhui ZHU

Realization of advance computational chip packaging (先进计算芯片的封装实践)

讲者/ 表演者:
Prof. Daojun LUO

Application verification and research of IC packaging materials (集成电路封装材料应用验证与研究)

语言
英文
普通话
适合对象
校友
教职员
研究生
主办单位
Electronic Packaging Laboratory
HKUST(GZ)
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