MPhil in Electronic & Comp Engg - Improved Reliability of CMOS interconnect with Ultra Low k dielectric using an hBN capping layer

Name: MPhil in Electronic & Comp Engg - Improved Reliability of CMOS interconnect with Ultra Low k dielectric using an hBN capping layer
Start: 2023-08-16
End: 2023-08-16

2023 年 8 月 16 日

2:30pm - 5:30pm