MPhil in Electronic & Comp Engg - Improved Reliability of CMOS interconnect with Ultra Low k dielectric using an hBN capping layer

Name: MPhil in Electronic & Comp Engg - Improved Reliability of CMOS interconnect with Ultra Low k dielectric using an hBN capping layer
Start: 2023-08-16
End: 2023-08-16

2023 年 8 月 16 日

2:30pm - 5:30pm

, HKUST

Supporting the below United Nations Sustainable Development Goals:支持以下聯合國可持續發展目標：支持以下联合国可持续发展目标：

活動形式

論文答辯

候選人

OKASHA, Mostafa Raafat Bakry

語言

英文