Name: MPhil in Mechanical Engineering - Effects of Thermally Conductive Underfill on the Thermal Resistance of Flip-Chip LEDs
Start: 2018-01-22
End: 2018-01-22

MPhil in Mechanical Engineering - Effects of Thermally Conductive Underfill on the Thermal Resistance of Flip-Chip LEDs

2018 年 1 月 22 日

2:30pm - 5:30pm

Room 5560 (lifts 27/28), HKUST

活动形式

论文答辩

候选人

SHANG, Andrew Weber

语言

英文

English