BEGIN:VCALENDAR
PRODID:-//HKUST Drupal Platform//EN
VERSION:2.0
BEGIN:VTIMEZONE
TZID:Asia/Hong_Kong
BEGIN:STANDARD
DTSTART:20071104T020000
TZOFFSETFROM:+0700
TZOFFSETTO:+0800
TZNAME:HKT
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTAMP;TZID=Asia/Hong_Kong:20260426T103341
DTSTART;TZID=Asia/Hong_Kong:20180122T143000
DTEND;TZID=Asia/Hong_Kong:20180122T173000
LOCATION:Room 5560 (lifts 27/28), HKUST
SUMMARY:MPhil in Mechanical Engineering - Effects of Thermally Conductive Underfill on the Thermal Resistance of Flip-Chip LEDs
UID:24940
END:VEVENT
END:VCALENDAR