International Symposium on
3D IC and Heterogeneous Integration
Supporting the below United Nations Sustainable Development Goals:支持以下聯合國可持續發展目標：支持以下联合国可持续发展目标：
Technical Program Committee
Members:
Prof. Tim Cheng, The Hong Kong University of Science and Technology
Prof. Lance Li, The University of Hong Kong
Prof. Ricky Lee, The Hong Kong University of Science and Technology
Secretariat:
Dr. Jeffery Lo, The Hong Kong University of Science and Technology (jefflo@ust.hk)
Session A: System Architecture & Design in the Era of 3D IC
26 April 2022 (Tuesday)
Chair: Prof. Tim Cheng, HKUST
Advanced System Integration Technologies- Past, Present and Future
Douglas Yu, TSMC
09:30 -10:00
Architecture Innovations with 3D Integration in the AI Era
Yuan Xie, Alibaba
10:00 - 10:30
Advanced Packaging: Enabling Moore's Law's Next Frontier Through Heterogeneous Integration
Raja Swaminathan, AMD
10:30 - 11:00
Micro-bumping vs. Hybrid Bonding: What Are the Pros and Cons Today and In the Future?
Sung Kyu Lim, Georgia Institute of Technology
11:00 - 11:30
Panel Discussion
11:30 - 12:15
Session B: 3D IC & M3D
27 April 2022 (Wednesday)
Chair: Prof. Lance Li, HKU
Co-Chair: Prof. Yang Chai, PolyU
M3D Integration using 2D Devices
Kaustav Banerjee, UCSB
14:00 - 14:30
Why Is Everybody Talking about Chiplets?
Subu Iyer, UCLA
14:30 - 15:00
3D Layer Stacking by Smart Cut Technology Enabling Manufacturing of High Density I/O
Ionut Radu, Soitec
15:00 - 15:30
3D Sequential Integration: Applications and Technology Overview
François Andrieu, CEA-Leti
15:30 - 16:00
Session C: System-in-Package & Heterogeneous Integration
28 April 2022 (Thursday)
Chair: Prof. Ricky Lee, HKUST
Delivering Power and Removing Heat
Two challenges that could become the Achilles heel for AI applications
Madhavan Swaminathan, Georgia Institute of Technology
09:30 - 10:00
Opportunities and Challenges for Heterogeneous Integration and 3D IC
Jan Vardaman, TechSearch International, Inc.
10:00 - 10:30
The Future is Fan-Out
Beth Keser, Intel Corporation
10:30 - 11:00
Chiplet Design and Heterogeneous Integration Packaging
John Lau, Unimicron Technology Corporation
11:00 - 11:30
Panel Discussion
11:30-12:15
