Terahertz Needle Beam Forming Transceiver Systems Based on Advanced Packaging and Massive Chiplet Integration

Future sensing and communication applications are converging toward a common technical objective: the development of miniaturized, integrated, reconfigurable, high-speed, and high-precision wireless hardware. These specific requirements fundamentally push the frequency of wireless systems into sub-THz regime, where both large absolute bandwidth and electrically large apertures can be achieved within a compact physical size. In this talk, three hardware solutions are presented, targeting sub-THz needle beam forming transceiver systems based on advanced packaging and massive chiplet integration. First, a 140-GHz monostatic SoC transceiver is demonstrated, which features a low-inherent-loss full-duplexer with self-interference cancellation, effectively mitigating beam-misalignment issues when interfacing with large THz EM apertures. Second, to explore the feasibility of >200GHz passive antennas and interconnects within low-cost organic packages, another 240-GHz SiP transceiver tailored for cross-polarimetric radar sensing is developed. Finally, implementing the 240-GHz SiP transceiver as the spatial feed, a 240-GHz 6400-element aperiodic reflectarray consists of 25 organic package modules and 400 CMOS chiplet integration is presented, which saves 93% of the silicon area with a given radiating aperture. The full system demonstrates <0.9° beamwidth with ±50° 2D beam steering range, and high-resolution near-field imaging. These hardware solutions and prototyping considerations provide a practical pathway toward large-scale, distributed and reconfigurable sub-THz wireless hardware.