MPhil in Mechanical Engineering - Effects of Thermally Conductive Underfill on the Thermal Resistance of Flip-Chip LEDs
2:30pm - 5:30pm
Room 5560 (lifts 27/28), HKUST
Event Format
Candidate
SHANG, Andrew Weber
Language
English
English
Post an event
Campus organizations are invited to add their events to the calendar.