Supporting the below United Nations Sustainable Development Goals:支持以下聯合國可持續發展目標：支持以下联合国可持续发展目标：
Abstract
Recently, UV LED technology has garnered attention for its potential to replace traditional UV lamps, which are commonly used in applications such as UV curing, medical phototherapy, and disinfection, among others. UV LEDs offer improved efficacy and are more environmentally friendly to produce than incumbent UV lamp technologies. Unfortunately, the cost of UV LEDs is still relatively high due to the use of ceramic substrates, favored for their UV resistance. Highly-reflective plastic, on the other hand, offers a cheap alternative to ceramic substrates, and is widely used as a leadframe material for traditional visible-wavelength LEDs. Some new plastics, namely epoxy molding compound (EMC) and silicone molding compound (SMC), exhibit UV resistance and thus show promise in UV LED packaging applications. Therefore, understanding the reliability of EMC and SMC under UV radiation and high temperature conditions is necessary. This paper focuses on change in reflectance of EMC and SMC leadframes over time as a measure of reliability.
Material aging was performed on EMC and SMC culls under high temperature without UV radiation and high temperature with UV radiation. Reflectance of EMC and SMC culls before and after aging were compared. It was concluded that both EMC and SMC degrade under high temperature and UV aging, and that SMC is more UV resistant than EMC based on surface morphology and roughness. Packaged UV LED aging was conducted at 85°C and 55°C. It was concluded that both EMC and SMC leadframes are suitable for UV LED packages with an emission wavelength of 370 nm and above. Overall, based on material aging, and packaged UV LED aging, it was concluded that SMC displays better UV resistance than that of EMC, and that both EMC and SMC can be used in UV LED packaging.
Speaker's Biography
Mr. Xing QIU received his bachelor degree in 2012 from Jilin University, China. Then he joined Department of Electronic Engineering, the Chinese University of Hong Kong for one year. At present, he is a PhD student in the Mechanical Engineering Department of HKUST.
Light refreshment will be served at the end of the seminar.
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Mr. Xing QIU received his bachelor degree in 2012 from Jilin University, China. Then he joined Department of Electronic Engineering, the Chinese University of Hong Kong for one year. At present, he is a PhD student in the Mechanical Engineering Department of HKUST.