MPhil in Electronic & Comp Engg - Improved Reliability of CMOS interconnect with Ultra Low k dielectric using an hBN capping layer

2:30pm - 5:30pm
Room 2463 (Lifts 25-26), 2/F Academic Building, HKUST
Event Format
Candidate
OKASHA, Mostafa Raafat Bakry
Language
English
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