PHD in Mechanical Engineering - Microscale Transport Phenomena and Bubble Dynamics in Microfluidic Electroless Copper for Chip 3D Integration

Name: PHD in Mechanical Engineering - Microscale Transport Phenomena and Bubble Dynamics in Microfluidic Electroless Copper for Chip 3D Integration
Start: 2024-08-14
End: 2024-08-14

14 August 2024

3:00pm - 6:00pm

Rm2548 + Rm2549, HKUST (2/F., Lift #27/28), Zoom Meeting: 3469229888 (Passcode: 135246), HKUST

Event Format

Thesis Defense

Candidate

ZHANG, Yonglin

Language

English