MPhil in Mechanical Engineering - Solvent-Free One-Component Epoxy Adhesive Incorporating Amine Microcapsules for Enhanced Thread Assemblies
10:30am - 1:30pm
Room 2550+2551 (Lifts 27-28), 2/F Academic Building, HKUST
Event Format
Thesis Defense
Candidate
CHAN, Cho Sin Nicole
Language
English