Name: MPhil in Mechanical Engineering - Effects of Thermally Conductive Underfill on the Thermal Resistance of Flip-Chip LEDs
Start: 2018-01-22
End: 2018-01-22

MPhil in Mechanical Engineering - Effects of Thermally Conductive Underfill on the Thermal Resistance of Flip-Chip LEDs

22 January 2018

2:30pm - 5:30pm

Room 5560 (lifts 27/28), HKUST

Supporting the below United Nations Sustainable Development Goals:支持以下聯合國可持續發展目標：支持以下联合国可持续发展目标：

Event Format

Thesis Defense

Candidate

SHANG, Andrew Weber

Language

English