MPhil in Electronic & Comp Engg - Improved Reliability of CMOS interconnect with Ultra Low k dielectric using an hBN capping layer
2:30pm - 5:30pm
Room 2463 (Lifts 25-26), 2/F Academic Building, HKUST
Event Format
Thesis Defense
Candidate
OKASHA, Mostafa Raafat Bakry
Language
English