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TZID:Asia/Hong_Kong
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DTSTART:20071104T020000
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DTSTAMP;TZID=Asia/Hong_Kong:20260525T093442
DTSTART;TZID=Asia/Hong_Kong:20210831T090000
DTEND;TZID=Asia/Hong_Kong:20210831T120000
LOCATION: , HKUST
SUMMARY:PHD in Electronic & Comp Engg - Integration of air-gaps into CMOS interconnect in the intra- and inter- metalization layers towards k=1
UID:28737
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