Metal additive manufacturing (AM) has the potential to impact an immense range of applications across industries, including the production of advanced structural, propulsion, and thermal management systems. However, current metal AM processes do not easily permit multi-material printing or local optimization of materials properties. By contrast, established processes that deposit metal directly have low resolution (e.g. directed energy deposition) or cannot achieve bulk metal properties (e.g. ink-based methods). In this talk, I will showcase two significant milestones that could potentially address these limitations. Firstly, I will present a new direct metal printing method involving on-demand deposition of discrete metal microparticles produced by electrohydrodynamic ejection from a water meniscus and followed by in-flight laser melting. We demonstrated the printing of solder and platinum particles ranging in size from 30-150 µm, and explored the process parameter space as limited by the ejection conditions and the kinetics of laser melting, droplet impingement, and solidification. The experiments demonstrate process compatibility with a wide range of power feedstock materials. Second, I will present a new route to enhance metal parts’ mechanical properties by in situ graphene growth. I developed a highly dynamic chemical vapor deposition (CVD) synthesis method to achieve high-quality graphene rapid growth (<1 min) on ultrathin metal films while overcoming solid-state dewetting instability, which usually occurs at high synthesis temperatures. As-grown graphene-metal interface enables efficient load transfer across the whole material and cracks bridging and energy dissipation during crack advancement. This new interface engineering approach can be potentially utilized in the metal particle printing process mentioned above, enabling high-performance nanocomposites manufacturing. My work opens the door for multi-material AM with tailored interfaces and functionalities and directly impacts the industries which have significant limitations in functionality integration and fine feature fabrication.