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PRODID:-//HKUST Drupal Platform//EN
VERSION:2.0
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TZID:Asia/Hong_Kong
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DTSTART:20071104T020000
TZOFFSETFROM:+0700
TZOFFSETTO:+0800
TZNAME:HKT
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DTSTAMP;TZID=Asia/Hong_Kong:20260525T024133
DTSTART;TZID=Asia/Hong_Kong:20240814T150000
DTEND;TZID=Asia/Hong_Kong:20240814T180000
LOCATION:Rm2548 + Rm2549, HKUST (2/F., Lift #27/28), Zoom Meeting: 3469229888 (Passcode: 135246), HKUST
SUMMARY:PHD in Mechanical Engineering - Microscale Transport Phenomena and Bubble Dynamics in Microfluidic Electroless Copper for Chip 3D Integration
UID:41749
END:VEVENT
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