BEGIN:VCALENDAR
PRODID:-//HKUST Drupal Platform//EN
VERSION:2.0
BEGIN:VTIMEZONE
TZID:Asia/Hong_Kong
BEGIN:STANDARD
DTSTART:20071104T020000
TZOFFSETFROM:+0700
TZOFFSETTO:+0800
TZNAME:HKT
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BEGIN:VEVENT
DTSTAMP;TZID=Asia/Hong_Kong:20260523T012614
DTSTART;TZID=Asia/Hong_Kong:20190923T123000
DTEND;TZID=Asia/Hong_Kong:20190923T153000
LOCATION:Room 2303 (Lifts 17-18), 2/F Academic Building, HKUST
SUMMARY:MPhil in Chem & Biomolecular Engg - Copper Thick Film Paste Formulation Development
UID:22595
END:VEVENT
END:VCALENDAR